Semiconductor Packaging Specialist
5 days ago
We are Doctech HK Ltd., a company dedicated to the development of various hybrid copper materials, especially for the applications of future three-dimensional integrated circuit (3DIC) packaging.
Job RequirementsThe ideal candidate will have a Master degree or above in Chemistry, Electrical, Material Science Engineering, or a related field, and proven experience in electrochemistry, particularly in the development of electroplating solutions.
- Lead the research and development of electroplating solutions for surface metal treatments, focusing on advanced additive formulations.
- Conduct in-depth material characterization and performance analysis of electroplated metals.
- Collaborate with the R&D team to innovate and optimize formulations to improve metal deposition quality, conductivity, and stability.
- Design and execute experiments to test electrochemical properties and develop novel methodologies for enhanced metal adhesion and materials stability.
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Electronics Design Specialist
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R & D Manager (Power Electronics)
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Supply Chain Packaging Specialist
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Senior Research Associate
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Materials Scientist
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Active EMI Filter Researcher
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Power Conversion Specialist
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Operations Support Specialist
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Senior QA Specialist
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Reservation Specialist
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