Chief Engineer, Advanced Packaging
4 days ago
Chief Engineer, Advanced Packaging – ASTRI – Hong Kong Applied Science and Technology Research Institute ASTRI was founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong’s competitiveness through applied research. Its core R&D competencies are grouped under five technology divisions: Advanced Electronic Components and Systems; Artificial Intelligence and Trust Technologies; Communications Technologies; IoT Sensing and AI Technologies; and Intelligent Perception and Control Technologies. The Institute’s research output supports six core areas including Smart City, Financial Technologies, New Industrialisation and Intelligent Manufacturing, Digital Health, Application Specific Integrated Circuits and Metaverse. Job Responsibilities Report to the Vice President, understand industry needs in Hong Kong and the Greater Bay Area, and define technology and product road‑maps for the semiconductor and new energy sectors. Implement the roadmap with five‑year project plans and prepare proposals for funding and industry support. Recruit, develop, and lead a strong team to execute projects and build patent and new‑product portfolios in semiconductor and new‑energy applications. Promote, market, and commercialize developed technologies and products. Initiate, coordinate, and consolidate R&D resources from universities, research institutes and other organisations to foster international collaborations and strengthen technology leadership. Perform ad‑hoc duties as assigned. Job Requirements Master’s degree or above in Electronics Packaging, Materials Science & Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related disciplines. 15+ years of experience in the semiconductor and/or new‑energy industries with deep expertise in semiconductor and new‑energy technologies and their application to electronic products. 10+ years of people‑management experience with strong leadership in strategy planning, resource integration, team establishment, plan execution and communication. In‑depth understanding of technology development trends and the full semiconductor or new‑energy product development cycle from package design to product qualification. Expertise in electronics materials, power electronics, photovoltaics, energy storage and broad collaboration with universities and companies (a plus). Good written and verbal communication skills in English. Strong team spirit, interpersonal skills, and an independent, responsible, aggressive, and outgoing character. Alignment with ASTRI values. The appointment is on renewable contract terms with a competitive base salary and performance‑linked variable pay. Fringe benefits include paid leave, medical insurance coverage and contributions to the MPF. The incumbent will normally work a five‑day week. Application Process Interested parties should submit a detailed CV within two weeks of the post date. Applicants are encouraged to apply as soon as possible; the review of applications will continue until the position is filled. The resume should not contain sensitive personal information such as ID card numbers or travel document numbers. Only short‑listed candidates will be notified. ASTRI reserves the right not to fill the position. ASTRI is an Equal Opportunities Employer. Personal data provided by job applicants will be used exclusively for recruitment purposes. For details, please refer to the ASTRI Privacy Policy Statement. #J-18808-Ljbffr
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