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Packaging Technology Lead

2 weeks ago

Hong Kong, Central and Western District, Hong Kong SAR China Nexperia Full time

Nexperia is an Equal Opportunity/Affirmative Action Employer.

Required Skills and Qualifications

To succeed in this role, you will need:

  • Degree: Bachelor/Master/PhD in Mechanical Engineering/Material Sciences related or equivalent.
  • Minimum 10 years of experience in R&D environment, especially in Semiconductor Process engineering/Design/Development.
  • Knowledge of WLCSP/Embedded packages/SIP packages technologies.
  • Strong knowledge in FMEA, SPC, DoE & troubleshooting skills/toolsets.
  • Ability to coach others.
  • Comprehensive knowledge of process and equipment technologies related to semiconductor packaging.

About Us

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is a 15,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals, and a drive to succeed regardless of the challenges we face. We support, reward, and challenge individuals equally in a dynamic and energetic environment.